Grain-boundary solute electromigration in polycrystalline films
- P.S. Ho
- J.K. Howard
- 2003
- Journal of Applied Physics
Publications
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118 results for Paul S. Ho
ORIGIN OF THE CARBON 1S-CORE LEVEL SHIFTS IN POLYIMIDE MODEL COMPOUNDS.
- B.D. Silverman
- P.N. Sanda
- et al.
- 2003
- Journal of polymer science. Part A-1, Polymer chemistry
Thickness–direction thermal‐expansion measurements
- Ravi F. Saraf
- Ho‐Ming Tong
- et al.
- 2003
- Journal of Applied Polymer Science
Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films
- Junjun Liu
- Dongwen Gan
- et al.
- 2002
- Applied Physics Letters
A Theoretical Study of the Bonding and XPS Spectra of Chromium Interacting with a Polyimide Model Compound
- A.R. Rossi
- P.N. Sanda
- et al.
- 2002
- Organometallics
Processing dependent thermal conductivity of nanoporous silica xerogel films
- Anurag Jain
- Svetlana Rogojevic
- et al.
- 2002
- Journal of Applied Physics
Designing porous low-k dielectrics
- Josh H. Golden
- Craig J. Hawker
- et al.
- 2001
- Semiconductor International
Electromigration in metals
- Paul S Ho
- Thomas Kwok
- 1999
- Reports on Progress in Physics
Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures
- I.-S. Yeo
- S.G.H. Anderson
- et al.
- 1995
- Journal of Applied Physics
Measurement of thermal stress and stress relaxation in confined metal lines. I. Stresses during thermal cycling
- M.A. Moske
- P.S. Ho
- et al.
- 1993
- Journal of Applied Physics