Electromigration failure due to interfacial diffusion in fine Al alloy lines
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Applied Physics Letters
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118 results for Paul S. Ho
Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Journal of Applied Physics
Measurement of thermal stress and stress relaxation in confined metal lines. II. Stress relaxation study
- M.A. Moske
- P.S. Ho
- et al.
- 1993
- Journal of Applied Physics
Chemistry and morphology of Cr/BPDA-PDA interface formation
- Steven G. Anderson
- Jihperng Leu
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Electromigration in two-level interconnect structures with Al alloy lines and W studs
- C.-K. Hu
- P.S. Ho
- et al.
- 1992
- Journal of Applied Physics
Simulated crystalline structures of aromatic polyimides
- Tze Wing Poon
- B. David Silverman
- et al.
- 1992
- Physical Review B
Thermal structural disorder and melting at a crystalline interface
- Tue Nguyen
- Paul S. Ho
- et al.
- 1992
- Physical Review B
Ledge interactions and stress relaxations on Si(001) stepped surfaces
- Tze Wing Poon
- Sidney Yip
- et al.
- 1992
- Physical Review B
An in situ Auger electron spectroscopy study of chromium thin film coverage of copper surfaces: Effects of surface morphology, temperature and environment
- H. Lefakis
- P.S. Ho
- 1991
- Thin Solid Films
Stress development, intermetallic phase formation, and reaction kinetics in Co-Cr and Co-Ti thin films
- F. Faupel
- D. Gupta
- et al.
- 1990
- Journal of Applied Physics