Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering
- F.M. D'Heurle
- J.M.E. Harper
- 1989
- Thin Solid Films
Publications
Date
Featured collections
Popular topics
122 results for J.M.E. Harper
A comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers
- A. Charai
- S.E. Harnstram
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
TIN formed by ion beam nitriding of TiSi2
- S.E. Harnstrarn
- D. Moy
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Mechanisms for success or failure of diffusion barriers between aluminum and silicon
- J.M.E. Harper
- S.E. Harnstram
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Angular dependence of preferential sputtering and composition in aluminum-copper thin films
- P. Rudeck
- J.M.E. Harper
- et al.
- 1988
- Applied Physics Letters
Theory of ripple topography induced by ion bombardment
- R.Mark Bradley
- James M.E. Harper
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Tungsten-rhenium alloys as diffusion barriers between aluminum and silicon
- S.-E. Hörnström
- T. Lin
- et al.
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Relationship between substrate bias and microstructure in magnetron-sputtered AlCu films
- T. Lin
- K.Y. Ahn
- et al.
- 1987
- Thin Solid Films
Summary abstract: Theory of thin-film orientation by ion bombardment during deposition
- R. Mark Bradley
- James M.E. Harper
- et al.
- 1987
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films