Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films
- C. Lavoie
- C. Detavernier
- et al.
- 2006
- Microelectronic Engineering
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122 results for J.M.E. Harper
On the use of alloying elements for Cu interconnect applications
- K. Barmak
- C. Cabral
- et al.
- 2006
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Resistivity-temperature behavior of dilute Cu(Ir) and Cu(W) alloy films
- Katayun Barmak
- Jr. Cabral
- et al.
- 2005
- Journal of Materials Research
Evaluation of thermal stability for CMOS gate metal materials
- C. Cabral Jr.
- C. Lavoie
- et al.
- 2004
- JES
Evolution of microstructure in Ti-Ta bilayer thin films on polycrystalline-Si and Si(001)
- A.S. Özcan
- K.F. Ludwig Jr.
- et al.
- 2004
- Thin Solid Films
Interfacial reactions between Al and RuO2, MoOx and WNx diffusion barriers on Si
- S.-E. Hörnström
- A. Charai
- et al.
- 2004
- Surface and Interface Analysis
Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
- R.F. Liu
- C.-K. Hu
- et al.
- 2004
- Journal of Applied Physics
Texture of Cu and dilute binary Cu-alloy films: Impact of annealing and solute content
- K. Barmak
- A. Gungor
- et al.
- 2003
- Materials Science in Semiconductor Processing
Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity
- K. Barmak
- A. Gungor
- et al.
- 2003
- Journal of Applied Physics
Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) allow thin films
- A. Gungor
- K. Barmak
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures