Mechanisms for enhanced C54-TiSi2 formation in Ti-Ta alloy films on single-crystal Si
- A. Quintero
- M. Libera
- et al.
- 1999
- Journal of Materials Research
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122 results for J.M.E. Harper
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere
- S.-L. Zhang
- C. Lavoie
- et al.
- 1999
- Journal of Applied Physics
Enhanced thermal stability of C49 TiSi2 in the presence of aluminum
- S.-L. Zhang
- F.M. D'Heurle
- et al.
- 1998
- Applied Physics Letters
Templating Effects On C54-Tisi2 Formation In Ternary Reactions.
- A. Quintero
- M. Libera
- et al.
- 1998
- Microscopy and Microanalysis
Extendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Evaluation of Al(Nd)-alloy films for application to thin-film-transistor liquid crystal displays
- H. Takatsuji
- E.G. Colgan
- et al.
- 1998
- IBM J. Res. Dev
Interdiffusion and phase formation in Cu(Sn) alloy films
- L. Clevenger
- B. Arcot
- et al.
- 1998
- Journal of Applied Physics
Copper interconnections and reliability
- C.-K. Hu
- J.M.E. Harper
- 1998
- Materials Chemistry and Physics