Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
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17 results at ECTC 2014
Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2014
- ECTC 2014
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- Yoichi Taira
- Ryuma Mizusawa
- et al.
- 2014
- ECTC 2014