Publications

17 results at ECTC 2014

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- - Bing Dang
  - Joana Maria
  - et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- - Tymon Barwicz
  - Yoichi Taira
  - et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- - Y. Liu
  - S.L. Wright
  - et al.
- 2014
- ECTC 2014
Preparing 25Gbps electrical I/O for exascale computing systems
- - Lei Shan
  - Young Kwark
  - et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- - Gregory Parks
  - Minhua Lu
  - et al.
- 2014
- ECTC 2014
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- - Minhua Lu
  - Charles Goldsmith
  - et al.
- 2014
- ECTC 2014