Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Publications
Date
Featured collections
Popular topics
17 results at ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
Preparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Modeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
Nanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- Yoichi Taira
- Ryuma Mizusawa
- et al.
- 2014
- ECTC 2014
A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2014
- ECTC 2014