Time, temperature, and mechanical fatigue dependence on underfill adhesion
- Joseph Cremaldi
- Michael Gaynes
- et al.
- 2014
- ECTC 2014
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17 results at ECTC 2014
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Preparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Development of electroless nickel-iron plating process for microelectronic applications
- Yu Luo
- Sung K. Kang
- et al.
- 2014
- ECTC 2014
Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014