Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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29 results at IEEE Transactions on CPMT

Through-silicon vias: Drivers, performance, and innovations
- - Paragkumar A. Thadesar
  - Xiaoxiong Gu
  - et al.
- 2016
- IEEE Transactions on CPMT
Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis
- - John N. Myers
  - Xiaoxian Zhang
  - et al.
- 2015
- IEEE Transactions on CPMT
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- - Ki Jin Han
  - Xiaoxiong Gu
  - et al.
- 2014
- IEEE Transactions on CPMT
Using via stubs in periodic structures for microwave filter design
- - Andreas Hardock
  - Young H. Kwark
  - et al.
- 2014
- IEEE Transactions on CPMT
Analysis and modeling of dc current crowding for tsv-based 3-d connections and power integrity
- - Xin Zhao
  - Michael R. Scheuermann
  - et al.
- 2014
- IEEE Transactions on CPMT
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2014
- IEEE Transactions on CPMT
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- - Xiaoxiong Gu
  - Joel A. Silberman
  - et al.
- 2013
- IEEE Transactions on CPMT
Complete modeling of large via constellations in multilayer printed circuit boards
- - Sebastian Müller
  - Fabian Happ
  - et al.
- 2013
- IEEE Transactions on CPMT
Accurate 3-D capacitance of parallel plates from 2-D analytical superposition
- - Richard E. Matick
  - Albert E. Ruehli
- 2013
- IEEE Transactions on CPMT
Foreword special section on through silicon vias
- - Dong Gun Kam
  - Joungho Kim
- 2011
- IEEE Transactions on CPMT