Topological Semimetal Resistivity Scaling for Vertical Interconnect Applications
- Nick Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters
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New Approach of LCDU Improvement for Via/Contact Hole Etch at Cryogenic Temperature
- Emilia Hirsch
- Dominik Metzler
- et al.
- 2024
- JVSTB