Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Optical packaging of silicon photonic devices for external connection of parallel optical signals
- - Yoichi Taira
  - Hidetoshi Numata
- 2013
- ECTC 2013
Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- - Xiaoxiong Gu
  - Dong Gun Kam
  - et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- - Akihiro Horibe
  - Kang-Wook Lee
  - et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- - Huanyu He
  - Zheng Xu
  - et al.
- 2013
- ECTC 2013
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- - Kang-Wook Lee
  - Stephane Barbeau
  - et al.
- 2013
- ECTC 2013
Single-chip 4 TX + 4 RX optical module based on holey SiGe transceiver IC
- - Fuad E. Doany
  - Daniel M. Kuchta
  - et al.
- 2013
- ECTC 2013
Investigation of novel solder patterns for power delivery and heat removal support
- - Thomas Brunschwiler
  - Yassir Madhour
  - et al.
- 2013
- ECTC 2013
Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- - Sung K. Kang
  - Jaewon Chang
  - et al.
- 2013
- ECTC 2013
On the impact of global information on diffusion of innovations over social networks
- - Youngmi Jin
  - Jungseul Ok
  - et al.
- 2013
- INFOCOM 2013
Coupling task progress for MapReduce resource-aware scheduling
- - Jian Tan
  - Xiaoqiao Meng
  - et al.
- 2013
- INFOCOM 2013