Critical angles for channeling of boron ions implanted into single-crystal silicon
- Chanahae Park
- Kevin M. Klein
- et al.
- 2019
- JES
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Structural Effects on a Submicron Trench Process
- Daeje Chin
- Sang H. Dhong
- et al.
- 2019
- JES
EFFECT OF Cu ON THE KINETICS AND MICROSTRUCTURE OF Al3Ti FORMATION.
- M. Wittmer
- F. Le Goues
- et al.
- 2019
- JES
Electrochemical and Metallurgical Aspects of Laser-Enhanced Jet Plating of Gold
- M.H. Gelchinski
- L. Romankiw
- et al.
- 2019
- JES
Mechanisms of Electroless Metal Plating II. Formaldehyde Oxidation
- Perminder Bindra
- Judith Roldan
- 2019
- JES
Computer simulation of dendritic electrodeposition
- Micha Tomkiewicz
- 2019
- JES
Selective dry etching of germanium with respect to silicon and vice versa
- G.S. Oehrlein
- T.D. Bestwick
- et al.
- 2019
- JES
The Analysis of Diffusion Data by a Method of Moments
- R. Ghez
- J.D. Fehribach
- et al.
- 2019
- JES
Temperature and Bias Effects on the Physical and Tribological Properties of Diamond-Like Carbon
- A. Grill
- V.V. Patel
- et al.
- 2019
- JES
Electrical Properties of Chemical-Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers
- S. Cohen
- M.A. Jaso
- et al.
- 2019
- JES