CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010
Publications
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Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010
Synthesizing near-optimal malware specifications from suspicious behaviors
- Matt Fredrikson
- Somesh Jha
- et al.
- 2010
- S&P 2010
Methodology for predicting C4 non-wets during the chip attach process
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Underfill acceleration factor based on thermal fatigue crack growth rate
- Soojae Park
- Claudius Feger
- et al.
- 2010
- ECTC 2010
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2010
- ECTC 2010
Direct measurement of local stress in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2010
- ECTC 2010
Scalable parametric verification of secure systems: How to verify reference monitors without worrying about data structure size
- Jason Franklin
- Sagar Chaki
- et al.
- 2010
- S&P 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010