Electrodeposition of SbTe phase-change alloys
- Q. Huang
- A.J. Kellock
- et al.
- 2008
- JES
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Effect of additives on shape evolution during electrodeposition
- Effendi Rusli
- Feng Xue
- et al.
- 2007
- JES
Deposition and characterization of Fe0.55 Co0.45 nanowires
- I. Shao
- M.W. Chen
- et al.
- 2007
- JES
Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
- M. Zheng
- J. Kelly
- et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- J. Kelly
- M. Zheng
- et al.
- 2007
- JES
Study of HCl and secco defect etching for characterization of thick sSOI
- A. Abbadie
- S.W. Bedell
- et al.
- 2007
- JES
Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
- E. Todd Ryan
- Jeremy Martin
- et al.
- 2007
- JES
Hydrogen Barrier Layer Against Silicon Oxidation during Atomic Layer Deposition of Al2 O3 and Hf O2
- Martin M. Frank
- Yu Wang
- et al.
- 2007
- JES
The effect of plasma chemistry on the damage induced to porous SiCOH dielectrics
- A. Grill
- V.V. Patel
- 2006
- JES