Enhanced cracking resistance of plasma deposited low k SiCOH films with nano imbedded layers
- Son Nguyen
- Eric Liniger
- et al.
- 2007
- ECS Meeting 2007
Publications
Date
Featured collections
Popular topics
11 results at ECS Meeting 2007
Materials and process integration issues in metal gate/high-k stacks and their dependence on device performance
- A.C. Callegari
- K. Babich
- et al.
- 2007
- ECS Meeting 2007
Atomic layer deposition for CMOS scaling: High-k gate dielectrics on Si, Ge, and III-V semiconductors
- 2007
- ECS Meeting 2007
Process and electrical characteristics of MO-ALD HfO2 films for high-K gate applications grown in a production-worthy 300 mm deposition system
- R.D. Clark
- C.S. Wajda
- et al.
- 2007
- ECS Meeting 2007
Challenges in FEOL logic device integration for 32 nm technology node and beyond
- Dae-Gyu Park
- M. Chudzik
- et al.
- 2007
- ECS Meeting 2007
Challenges and issues in 65nm CMOS logic technology
- Woo-Hyeong Lee
- 2007
- ECS Meeting 2007
Post ion-implant photoresist removal via wet chemical cleans combined with physical force pretreatments
- G.G. Totir
- M.M. Frank
- et al.
- 2007
- ECS Meeting 2007
Recent advances in search for suitable high-k/metal gate solutions to replace SiON/Poly-silicon gate stacks in CMOS devices for 45nm and beyond technologies
- B.P. Linder
- V.K. Paruchuri
- et al.
- 2007
- ECS Meeting 2007
Mixed orientation Si-Si interfaces by hydrophilic bonding and high temperature oxide dissolution: Wafer fabrication technique and device applications
- K.L. Saenger
- J.P. De Souza
- et al.
- 2007
- ECS Meeting 2007
Challenge for high-k/metal gate CMOSFETs in 32 nm generation and beyond
- M. Takayanagi
- 2007
- ECS Meeting 2007