Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
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11 results at IRPS 2012
Tailoring dielectric materials for robust BEOL reliability
- G. Bonilla
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
Detailed study of fast transient relaxation of Vt instability in HKMG nFETs
- K. Zhao
- James Stathis
- et al.
- 2012
- IRPS 2012
Generalized successive failure methodology for non-Weibull distributions and its applications to SiO 2 or high-k/SiO 2 bilayer dielectrics and extrinsic failure mode
- Ernest Wu
- Jordi Suñé
- et al.
- 2012
- IRPS 2012
Min-log approach to modeling dielectric breakdown data
- Emmanuel Yashchin
- Baozhen Li
- et al.
- 2012
- IRPS 2012
Usage-based degradation of SRAM arrays due to bias temperature instability
- Aditya Bansal
- Jae-Joon Kim
- et al.
- 2012
- IRPS 2012
Resistance drift in phase change memory
- Jing Li
- Binquan Luan
- et al.
- 2012
- IRPS 2012
The effect of voltage bias stress on temperature-dependent conduction properties of low-k dielectrics
- Joanna Atkin
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
Near-infrared photon emission spectroscopy of a 45 nm SOI ring oscillator
- Ulrike Kindereit
- Alan J. Weger
- et al.
- 2012
- IRPS 2012
Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB
- Fen Chen
- Jeffrey Gambino
- et al.
- 2012
- IRPS 2012