Epitaxy of ultrathin NiSi2 films with predetermined thickness
- Xindong Gao
- Joakim Andersson
- et al.
- 2011
- Electrochemical and Solid-State Letters
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15 results at Electrochemical and Solid-State Letters
Millisecond flash annealing as a flatband voltage shift enabler for p-type metal-oxide-semiconductor devices with high-k/metal gate
- Changhwan Choi
- Vijay Narayanan
- 2011
- Electrochemical and Solid-State Letters
Thermal stability of copper contact metallization using Ru-containing liner
- Soon-Cheon Seo
- C.-C. Yang
- et al.
- 2011
- Electrochemical and Solid-State Letters
Effects of contact area on mechanical strength, electrical resistance, and electromigration reliability of Cu/Low- k interconnects
- C.-C. Yang
- T.M. Shaw
- et al.
- 2010
- Electrochemical and Solid-State Letters
Selective chemical vapor deposition-grown Ru for Cu interconnect capping applications
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2010
- Electrochemical and Solid-State Letters
Activation of implanted n-type dopants in Ge over the active concentration of 1× 1020 cm-3 using coimplantation of Sb and P
- Jeehwan Kim
- Stephen W. Bedell
- et al.
- 2009
- Electrochemical and Solid-State Letters
Suppressor effects during copper superfilling of sub-100 nm lines
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2009
- Electrochemical and Solid-State Letters
Epitaxial formation of a metastable hexagonal nickel-silicide
- K. De Keyser
- C. Van Bockstael
- et al.
- 2008
- Electrochemical and Solid-State Letters
Single-crystalline Germanium thin films by electrodeposition and solid-phase epitaxy
- Q. Huang
- S.W. Bedell
- et al.
- 2007
- Electrochemical and Solid-State Letters
Anisotropic growth of nanostructures in germanium electroplating
- Q. Huang
- H. Deligianni
- et al.
- 2007
- Electrochemical and Solid-State Letters