Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2010
- JOM
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8 results at JOM
An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
The oxidation of lead-free Sn alloys by electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2005
- JOM
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- Sung K. Kang
- Da-Yuan Shih
- et al.
- 2004
- JOM
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
The status of two-dimensional Si/SiGe heterostructures
- Shelby F. Nelson
- 1993
- JOM
Interconnection technologies and materials science
- W.L. Winterbottom
- S.K. Kang
- 1991
- JOM
The application of expert systems to process control
- Bevan P.F. Wu
- 1991
- JOM