Interconnect and circuit modeling techniques for full-chip power supply noise analysis
- Howard H. Chen
- J. Scott Neely
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
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13 results at IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Low-cost fabrication of optical subassemblies
- Mitchell S. Cohen
- Glen W. Johnson
- et al.
- 1997
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1997
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Modeling and design of antennas for RF wireless systems
- Saila Ponnapalli
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Broadband characterization of low dielectric constant and low dielectric loss CYTUF™ cyanate ester printed circuit board material
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Adhesion enhancement and lamination of polyimide films
- Nancy C. Stoffel
- Meng Hsieh
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Evaluation of Contact Resistance for Isotropic Electrically Conductive Adhesives
- Ravi F. Saraf
- Judith M. Roldan
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Integrated Flex: Rigid-Flex Capability in a High Performance MCM
- Charles R. Davis
- John S. Kresge
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Latent Open Defect Detection Using Phase-Sensitive Nonlinearity Detection Technique
- Thomas H. DiStefano
- Shinwu Chiang
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Thin Film Transfer Process for Low Cost MCM-D Fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B