Lead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007
Bing Dang
Overview
Title
Manager/Master Inventor/Senior Research Scientist
Location
IBM Research - Yorktown Heights
Yorktown Heights, NY USA
Bio
Dr. Bing Dang is the Manager of Digital Health Engineering Group, where he is leading research and development of AI tools and software platform for Digital Health applications. In the past 10 years, he also worked on healthcare device innovation and IoT system integration. He earned his Ph.D. degree in Electrical and Computer Engineering from Georgia Institute of Technology in 2006 and also holds M.S. degrees in Electrical and Computer Engineering, Mechanical Engineering and Physical Chemistry.
He has published more than 75 technical papers in peer-reviewed journals and international conferences, authored 2 book chapters, and received numerous paper awards since 2006. He is an IEEE Senior Member and served as Technical Committee members in various IEEE conferences including ICDH and ECTC, etc. He has been granted more than 143 patents and received 35 IBM Innovation Achievement Awards, an Outstanding Innovation Award and an Outstanding Technical Achievement Award at IBM. He was named as an IBM Master Inventor for his sustained and outstanding IP contributions in 2021.
Publications
'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- Muhannad S. Bakir
- Bing Dang
- et al.
- 2007
- ECTC 2007
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
Electromigration resistant power delivery systems
- Deepak C. Sekar
- Bing Dang
- et al.
- 2007
- IEEE Electron Device Letters
Sea-of-Leads MEMS I/O interconnects for low-k IC packaging
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2006
- JMEMS
Characterization of flip chip microjoins up to 40 GHz using silicon carrier
- Chirag S. Patel
- Paul S. Andry
- et al.
- 2005
- IITC 2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
Optimal implementation of sea of leads (SoL) compliant interconnect technology
- Bing Dang
- Chirag Patel
- et al.
- 2004
- IITC 2004
Patents
- US
- 11666269
- US
- 11587860
- US
- 11574835
- US
- 11539081
- US
- 11539080
- US
- 11539088
- CN
- ZL201780027749.7
- US
- 11522243
- CN
- ZL201780016175.3
- US
- 11424152
Top collaborators
BW
Bo Wen
Staff Research Scientist, AGI Expert, Master Inventor, Cloud Architect, Tech Lead for Digital Health
VS
Vince Siu
Research Staff Member - Digital Health Engineering
JR
Jeff Rogers
Global Research Leader-Digital Health, Distinguished Scientist, Senior Manager
TI
Takashi Itoh
Advisory Software Engineer