High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
Bing Dang
Overview
Title
Manager/Master Inventor/Senior Research Scientist
Location
IBM Research - Yorktown Heights
Yorktown Heights, NY USA
Bio
Dr. Bing Dang is the Manager of Digital Health Engineering Group, where he is leading research and development of AI tools and software platform for Digital Health applications. In the past 10 years, he also worked on healthcare device innovation and IoT system integration. He earned his Ph.D. degree in Electrical and Computer Engineering from Georgia Institute of Technology in 2006 and also holds M.S. degrees in Electrical and Computer Engineering, Mechanical Engineering and Physical Chemistry.
He has published more than 75 technical papers in peer-reviewed journals and international conferences, authored 2 book chapters, and received numerous paper awards since 2006. He is an IEEE Senior Member and served as Technical Committee members in various IEEE conferences including ICDH and ECTC, etc. He has been granted more than 143 patents and received 35 IBM Innovation Achievement Awards, an Outstanding Innovation Award and an Outstanding Technical Achievement Award at IBM. He was named as an IBM Master Inventor for his sustained and outstanding IP contributions in 2021.
Publications
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010
Integrated microfluidic cooling and interconnects for 2D and 3D chips
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Reliable through silicon vias for 3D silicon applications
- M.J. Shapiro
- M. Interrante
- et al.
- 2009
- IITC 2009
C4NP technology: Present and future
- Eric Perfecto
- Da-Yuan Shih
- et al.
- 2008
- GBC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Patents
- US
- 12121368
- GB
- 2603839
- US
- 12014816
- JP
- 7477250
- US
- 11876233
- US
- 11850068
- US
- 11810893
- US
- 11710669
- US
- 11696683
- US
- 11685580
Top collaborators
BW
Bo Wen
Staff Research Scientist, AGI Expert, Master Inventor, Cloud Architect, Tech Lead for Digital Health
VS
Vince Siu
Research Staff Member - Digital Health Engineering
JR
Jeff Rogers
Global Research Leader-Digital Health, Distinguished Scientist, Senior Manager
TI
Takashi Itoh
Advisory Software Engineer