- US
- 11791270
Patents
- US
- 11355379
- US
- 10991635
- TW
- I397827
- JP
- 5004576
- JP
- 4738349
- CN
- ZL200480040507.4
- CN
- ZL200710001544.X
- US
- 7475368
- US
- 6892781
Projects
Silicon Bridge Chiplet Integration
Developing a new chiplet integration technology using silicon bridge for advanced semiconductor packaging.
Blog posts
What is chip packaging?
ExplainerMike MurphyThe breakthrough that could simplify the 3D chipmaking supply chain
NewsDale McHerron
