Anuj Madan, Jiong Jiong Mo, et al.
RADECS 2009
The full leverage offered by electron-beam (e-beam) lithography has been exploited in a scaled 0.25- μm double-poly-silicon bipolar technology. Devices and circuits were fabricated using e-beam lithography for all mask levels with level-to-level overlays tighter than 0.06 μm. Ion implantation was used to form a sub-100-nm intrinsic base profile, and a novel in-situ doped polysilicon emitter process was used to minimize narrow emitter effects. Transistors with 0.25- μm emitter width have current gains above 80 and cutoff frequencies as high as 40 GHz. A record ECL gate delay of 20.8 ps at 4.82 mW has been measured together with a minimum power-delay product of 47 fJ (42.1 ps at 1.12 mW). These results demonstrate the feasibility and resultant performance leverage of aggressive scaling of conventional bipolar technologies. © 1992 IEEE
Anuj Madan, Jiong Jiong Mo, et al.
RADECS 2009
Jonathan A. Pellish, Robert A. Reed, et al.
IEEE TNS
Marco Bellini, John D. Cressler, et al.
BCTM 2007
G. Shahidi, James Warnock, et al.
IEEE Electron Device Letters