Alpha-particle emission energy spectra from materials used for solder bumps

Michael S. Gordon; Kenneth P. Rodbell; David F. Heidel; Conal E. Murray; Henry H. K. Tang; Brendan Dwyer-Mcnally; William K. Warburton

doi:10.1109/TNS.2010.2085015

IEEE TNS

Paper

01 Dec 2010

Alpha-particle emission energy spectra from materials used for solder bumps

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Abstract

The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution. © 2010 IEEE.

Conference paper