Chemical and physical aspects of multilayer resist processing
J. Paraszczak, E. Babich, et al.
Proceedings of SPIE 1989
Phosphorus redistribution during thermal oxidation of degenerately doped silicon was investigated using Auger electron spectroscopy and ellipsometry. Concentration profiles were determined with a combination of chemical and sputter etching techniques. A substantial phosphorus pileup was observed in the oxide in a thin layer near the ellipsometrically determined Si-SiO2 interface. Calibrated against standards of known concentration, this layer was found to contain -2 x 1021 phosphorus atoms/cm3, independent of the oxidation temperature between 850° and 1000 °C. © 1974 IOP Publishing Ltd.
J. Paraszczak, E. Babich, et al.
Proceedings of SPIE 1989
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
R.L. Hollis, R. Hammer, et al.
Journal of Materials Science
N.J. Chou, S.K. Lahiri, et al.
The Journal of Chemical Physics