M.A. Lutz, R.M. Feenstra, et al.
Surface Science
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
M.A. Lutz, R.M. Feenstra, et al.
Surface Science
I. Morgenstern, K.A. Müller, et al.
Physica B: Physics of Condensed Matter
G. Will, N. Masciocchi, et al.
Zeitschrift fur Kristallographie - New Crystal Structures
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics