S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
J.C. Marinace
JES
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999