Denny D. Tang, Pong-Fei Lu
IEEE Electron Device Letters
TEM analyses show metal migration into the polysilicon emitter of a bipolar transistor after high current stress. At the edges of the polysilicon emitter where the current density was expected to be the highest, a metal filament was seen penetrating into the edge of the polysilicon emitter after stressing at a current density of 16.3 mA/ μm2 for 1.68 x 105 s at 90°C. The metal penetration into polysilicon offers a possible cause for the previous electrical measurement [1], in which a slight lowering of the emitter contact resistance occurs after the same stress. © 1992 IEEE
Denny D. Tang, Pong-Fei Lu
IEEE Electron Device Letters
Siegfried K. Wiedmann, Denny D. Tang
ISSCC 1981
Denny D. Tang, R.E. Burger
IEEE Journal of Solid-State Circuits
Roderic Beresford, Denny D. Tang
IEEE Journal of Solid-State Circuits