Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications
- Qianwen Chen
- Bing Dang
- et al.
- 2020
- ECTC 2020
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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33 results for Jae Woong Nah
Novel solder pads for self-aligned flip-chip assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2019
- ECTC 2019
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices
- Bing Dang
- Qianwen Chen
- et al.
- 2019
- ECTC 2019
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2017
- ECTC 2017
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- Yves Martin
- Jae Woong Nah
- et al.
- 2016
- ECTC 2016
Planarity-tolerant fine-pitch reworkable interconnections with sharp protrusions and microbumps
- Y. Liu
- Steven L. Wright
- et al.
- 2015
- ECTC 2015