Matthias Kaiserswerth
IEEE/ACM Transactions on Networking
IBM 90-nm silicon-on-insulator (SOI) technology was used for the key chips in the System z9™ processor chipset. Along with system design, optimization of some critical features of this technology enabled the z9™ to achieve double the system performance of the previous generation. These technology improvements included logic and SRAM FET optimization, mask fabrication, lithography and wafer processing, and interconnect technology. Reliability improvements such as SRAM optimization and burn-in reliability screen are also described. ©Copyright 2007 by International Business Machines Corporation.
Matthias Kaiserswerth
IEEE/ACM Transactions on Networking
Frank R. Libsch, Takatoshi Tsujimura
Active Matrix Liquid Crystal Displays Technology and Applications 1997
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Sonia Cafieri, Jon Lee, et al.
Journal of Global Optimization