Electrical characterization of 3D Through-Silicon-Vias
Fei Liu, Xiaoxiong Gu, et al.
ECTC 2010
Self-heating of FinFET transistors is a reliability concern, especially for large devices with dense arrays of fins on Silicon On Insulator. In this paper, device-level temperature measurements acquired using an optical technique are presented. The 2-D time-resolved emission measurements through the substrate are used to monitor the temperature-dependent modulation of the OFF-state leakage current of individual transistors, noninvasively and with high time accuracy. Different device geometries and operating conditions are evaluated and compared.
Fei Liu, Xiaoxiong Gu, et al.
ECTC 2010
Wenjuan Zhu, Damon B. Farmer, et al.
Applied Physics Letters
Peilin Song, Stas Polonsky, et al.
Electronic Device Failure Analysis
Lijun Jiang, Chuan Xu, et al.
IEEE Transactions on Advanced Packaging