G.M. McClelland, C.T. Rettner, et al.
Tribology Letters
Thin polyimide films with dispersed nano-foam morphology have been investigated for the purpose of obtaining low dielectric polymer insulators for microelectronic applications. A Significant decrease in the average dielectric constant has been achieved by the formation of nano-foam morphology. We will present the polymer structure-dielectric property relationships for the matrix homopolymers and the changes brought about by final nano-foam formation.
G.M. McClelland, C.T. Rettner, et al.
Tribology Letters
V. Brusic, Marie Angelopoulos, et al.
SPE ANTEC 1995
D.Y. Yoon, G.D. Smith, et al.
SPE ANTEC 1995
J.S. Fodor, R.M. Briber, et al.
Journal of Polymer Science, Part B: Polymer Physics