Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
We report the microfabrication of a 32×32 (1024) 2D cantilever array chip and its electrical testing. It has been designed for ultrahigh-density, high-speed data storage applications using thermomechanical writing and readout in thin polymer film storage media. The fabricated chip is the first very large scale integration (VLSI)-NEMS (NanoEMS) for nanotechnological applications. For electrical and thermal stability, the levers are made of silicon, and the heater/sensor element is defined as a lower, doped platform with the tip on top. Freestanding cantilevers are obtained with surface-micromachining techniques, which yield better mechanical stability and heatsinking of the chip than bulk-micromachining releasing techniques do. Two-wiring levels interconnect the cantilevers for a time-multiplexed row/column addressing scheme. By integrating a Schottky diode in series with each cantilever, a considerable reduction of crosstalk between cantilevers has been achieved.
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures