Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- Anna W. Topol
- Bruce K. Furman
- et al.
- 2004
- ECTC 2004
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13 results for George F. Walker
Fabrication and Mobility Characteristics of Ultra-thin Strained Si Directly on Insulator (SSDOI) MOSFETs
- K. Rim
- K.K. Chan
- et al.
- 2003
- IEDM 2003
Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
High performance FDSOI CMOS technology with metal gate and high-k
- Bruce Doris
- Y.-H. Kim
- et al.
- 2005
- VLSI Technology 2005
Organic passivation of copper for MCM-D packaging
- K.-W. Lee
- G.F. Walker
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Isothermal Sintering of Spheroidized Cordierite‐Type Glass Powders
- Edward A. Giess
- Carl F. Guerci
- et al.
- 2006
- JACerS
Adhesion of poly(arylene ether benzimidazole) to copper and polyimides
- K.-W. Lee
- A. Viehbeck
- et al.
- 1996
- Journal of Adhesion Science and Technology
Formation of polyimide–Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion
- K.-W. Lee
- G.F. Walker
- et al.
- 1995
- Journal of Adhesion Science and Technology
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
Polyimide on copper: The role of solvent in the formation of copper precipitates
- Steven P. Kowalczyk
- Young-Ho Kim
- et al.
- 1988
- Applied Physics Letters