Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
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67 results for D.Y. Shih
Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Materials Research
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- AGEC 2004
Oxidation study of pure tin and its alloys via electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2004
- Symposium on “Challenges in Advanced Thin Films: Microstructures, Interfaces, and Reactions" 2004
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- Sung K. Kang
- Da-Yuan Shih
- et al.
- 2004
- JOM
Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Electronic Materials
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Won Kyoung Choi
- Sung K. Kang
- et al.
- 2003
- ECTC 2003