Porous ILD process development for sub 100nm integration
- K. Malone
- S.T. Chen
- et al.
- 2003
- ADMETA 2003
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14 results for J.C Hedrick
The study of modified layers in SiCOH dielectrics using spectroscopic ellipsometry
- Marcus A. Worsley
- Stacey F. Bent
- et al.
- 2003
- MRS Proceedings 2003
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Toughened polycyanurate thermosets for electronic applications
- J.C. Hedrick
- Jeffrey T. Gotro
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Microwave processing of thermoplastic modified epoxy resin networks
- J.C. Hedrick
- D.A. Lewis
- et al.
- 1991
- ANTEC Annual Technical Conference 1991
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
Structure-property relationships of hydrido organo siloxane polymer (HOSP)
- Ann R. Fornof
- Christy Tyberg
- et al.
- 2002
- Polymer Bulletin
Broadband characterization of low dielectric constant and low dielectric loss CYTUF™ cyanate ester printed circuit board material
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Future packaging materials: Cost performance, and environmental issues
- J.M. Shaw
- Stephen L. Buchwalter
- et al.
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
Microporous polycyanurate networks
- J.L. Hedrick
- T.P. Russell
- et al.
- 1996
- J Polym Sci Part A