Robust ultrathin (20-25 nm) trilayer dielectric low k Cu damascene cap for sub-30 nm nanoelectronic devices
- Son Nguyen
- T. Haigh
- et al.
- 2011
- ECS Meeting 2011
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155 results for Alfred Grill
Electrical characterization of wafer-scale epitaxial graphene and its RF applications
- Yu-Ming Lin
- Keith A. Jenkins
- et al.
- 2011
- IMS 2011
Optimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- D. Kioussis
- E.T. Ryan
- et al.
- 2011
- IITC/MAM 2011
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Graphene-based fast electronics and optoelectronics
- Ph. Avouris
- Yu-Ming Lin
- et al.
- 2010
- DRC 2010
Ultrathin (5-35 nm) SiCNH dielectrics for damascene Cu Cap application: Thickness scaling and oxidation barrier performance limitation
- Son Nguyen
- T. Haigh Jr.
- et al.
- 2010
- ECS Meeting 2010
Graphene RF transistor performance
- Keith A. Jenkins
- Yu-Ming Lin
- et al.
- 2010
- ECS Transactions
X-ray scattering methods for porosity metrology of low-k thin films
- C.M. Settens
- V.K. Kamineni
- et al.
- 2009
- FCMN 2009
Spectroscopic ellipsometry of porous low-κ dielectric thin films
- V.K. Kamineni
- C.M. Settens
- et al.
- 2009
- FCMN 2009
Integration compatible porous SiCOH dielectrics from 45 to 22 nm
- S. Gates
- A. Grill
- et al.
- 2008
- ADMETA 2008