Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
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124 results for Subramanian S. Iyer
0.026μm2 high performance Embedded DRAM in 22nm technology for server and SOC applications
- C. Pei
- G. Wang
- et al.
- 2014
- IEDM 2014
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Embedded memory considerations in SOI
- G. Wang
- Carl Radens
- et al.
- 2010
- IEEE International SOI Conference 2010
Access transistor design and optimization for 65/45nm high performance SOI eDRAM
- G. Wang
- P. Parries
- et al.
- 2008
- VLSI-TSA 2008
Reliability investigation of NiPtSi electrical fuse with different programming mechanisms
- C. Tian
- D. Moy
- et al.
- 2007
- IIRW 2007
Electrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips
- Norm Robson
- John Safran
- et al.
- 2007
- CICC 2007
Reliability qualification of CoSI2 electrical fuse for 90NM technology
- C. Tian
- B. Park
- et al.
- 2006
- IRPS 2006
Process induced stress for CMOS performance improvement
- S. Fang
- S.S. Tan
- et al.
- 2006
- ICSICT 2006
Grain-boundary states and hydrogenation of fine-grained polycrystalline silicon films deposited by molecular beams
- D. Joussej
- S.L. Delage
- et al.
- 2006
- Philosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties