Demonstration of a p-Channel BICFET in the GexSi1-x/Si System
- R.C. Taft
- James D. Plummer
- et al.
- 1989
- IEEE Electron Device Letters
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124 results for Subramanian S. Iyer
Silicon-Germanium-Base Heterojunction Bipolar Transistors By Molecular Beam Epitaxy
- Gary L. Patton
- Subramanian S. Iyer
- et al.
- 1988
- IEEE Electron Device Letters
Lowerature wafer bonding for three-dimensional wafer-scale integration
- Zhe Wan
- Kevin Winstel
- et al.
- 2018
- S3S 2018
Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applications
- C. Kothandaraman
- X. Chen
- et al.
- 2015
- IRPS 2015
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Embedded memory considerations in SOI
- G. Wang
- Carl Radens
- et al.
- 2010
- IEEE International SOI Conference 2010
Access transistor design and optimization for 65/45nm high performance SOI eDRAM
- G. Wang
- P. Parries
- et al.
- 2008
- VLSI-TSA 2008
Reliability investigation of NiPtSi electrical fuse with different programming mechanisms
- C. Tian
- D. Moy
- et al.
- 2007
- IIRW 2007
Electrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips
- Norm Robson
- John Safran
- et al.
- 2007
- CICC 2007