Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016
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156 results for Willi Volksen
Post Porosity Plasma Protection applied to a wide range of ultra low-k materials
- Theo Frot
- Willi Volksen
- et al.
- 2012
- IITC 2012
Planar collimated illumination system using nano-hybrid low index materials
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2011
- FiO 2011
Future of PECVD and spin-on ultra low-k materials
- Willi Volksen
- Theo Frot
- et al.
- 2011
- IITC/MAM 2011
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
Superior mechanical properties of dense and porous organic/inorganic hybrid thin films
- Willi Volksen
- Geraud Dubois
- et al.
- 2007
- VMIC 2007
Analysis of plasma-induced modification of ULK and eULK Materials: Dual damascene processing challenges for 45nm (κ ≤ 2.4) and beyond BEOL technologies
- N. Fuller
- M.A. Worsley
- et al.
- 2006
- IITC 2006
Laser spike annealing: A novel post-porosity treatment for significant toughening of low-k organosilicates
- Willi Volksen
- Geraud Dubois
- et al.
- 2006
- IITC 2006
Laser spike annealing: A novel post-porosity treatment for toughening of low-k organosilicates
- Willi Volksen
- Geraud Dubois
- et al.
- 2006
- VMIC 2006
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- Dubois Geraud
- Teddie Magbitang
- et al.
- 2005
- IITC 2005