Sub-10-9 Ω-cm2 n-Type Contact Resistivity for FinFET Technology
- Hiroaki Niimi
- Zuoguang Liu
- et al.
- 2016
- IEEE Electron Device Letters
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34 results for Oleg Gluschenkov
Performance dependence of CMOS on silicon substrate orientation for ultrathin oxynitride and HfO2 gate dielectrics
- Min Yang
- Evgeni P. Gusev
- et al.
- 2003
- IEEE Electron Device Letters
Improving FinFET Junctions and Contacts via Laser Annealing
- Oleg Gluschenkov
- Yasir Sulehria
- et al.
- 2023
- IWJT 2023
Impact of Nanosecond Laser Anneal on PVD Ru Films
- D. Sil
- Yasir Sulehria
- et al.
- 2021
- IITC 2021
Energy density and temperature calibration for feol nanosecond laser annealing
- Yasir Sulehria
- Oleg Gluschenkov
- et al.
- 2020
- ASMC 2020
Simulation of 3D Doping by Plasma Immersion Ion Implantation for FinFET or deep Trench Doping Applications. Effect of main Process Parameters and Study of Wall Doping Non-Uniformity as Function of Form Factor and Device Scaling
- Frank Torregrosa
- Benjamin Roux
- et al.
- 2018
- IIT 2018
Laser annealing in CMOS manufacturing
- Oleg Gluschenkov
- H. Jagannathan
- 2018
- ECS Meeting 2018
Dual beam laser annealing for contact resistance reduction and its impact on VLSI integrated circuit variability
- Zuoguang Liu
- Oleg Gluschenkov
- et al.
- 2017
- VLSI Technology 2017
Process optimizations for NBTI/PBTI for future replacement metal gate technologies
- Barry P. Linder
- A. Dasgupta
- et al.
- 2016
- IRPS 2016
Characterization and mitigation of overlay error on silicon wafers with nonuniform stress
- T.A. Brunner
- V. Menon
- et al.
- 2014
- SPIE Advanced Lithography 2014