Enhancing 3D XPT/SOM Reliability: Strategies for Mitigating Spike Current and Improving Read Endurance
- C.L. Sung
- D. Daudelin
- et al.
- 2025
- IMW 2025
Publications
30 results for E. Lai
A GexSe1-x switch-only-memory technology through polarized atomic distribution
- Zhi-Lun Liu
- Alexander Grun
- et al.
- 2024
- Scientific Reports
As-Se-Ge-S and Ge-N Heterostructures for Superior OTS Performance
- A. Grun
- Z.L. Lui
- et al.
- 2024
- IMW 2024
A Novel Program-verify Free and Low Drift Multi-level Operation on Cross-point OTS-PCM for In-Memory Computing Application
- W.C. Chien
- C.L. Sung
- et al.
- 2024
- IMW 2024
A Comprehensive Study on the Pillar Size of OTS-PCM Memory with an Optimized Process and Scaling Trends Down to Sub-10 nm for SCM Applications
- W. Chien
- E. Lai
- et al.
- 2023
- IMW 2023
New Phase-Change Materials by Atomic-Level Engineering the Dopants for Extremely Low VthDrift at 85 °C and High Endurance 3D Crosspoint Memory : IBM/Macronix PCRAM Joint Project
- Huai-Yu Cheng
- A. Grun
- et al.
- 2022
- IEDM 2022
Endurance Evaluation on OTS-PCM Device using Constant Current Stress Scheme
- W. Chien
- Lynne Gignac
- et al.
- 2022
- IRPS 2022
Device Study on OTS-PCM for Persistent Memory Application : IBM/Macronix Phase Change Memory Joint Project
- W. Chien
- Lynne Gignac
- et al.
- 2022
- EDTM 2022
Si Incorporation Into AsSeGe Chalcogenides for High Thermal Stability, High Endurance and Extremely Low Vth Drift 3D Stackable Cross-point Memory
- Huai-Yu Cheng
- I. Kuo
- et al.
- 2020
- VLSI Technology 2020
A no-verification Multi-Level-Cell (MLC) operation in Cross-Point OTS-PCM
- Nanbo Gong
- W. Chien
- et al.
- 2020
- VLSI Technology 2020