Block-Level Design Optimization for Sub-100-nm Cell Height Libraries with Stacked TransistorNick LanzilloJim Mazzaet al.2025IEDM 2025
Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnectsKoichi MotoyamaJaemyung Choiet al.2024IEDM 2024
Monolithic Stacked FET with Stepped Channels for Future Logic TechnologiesChen ZhangSeungmin Songet al.2024IEDM 2024
Vertical-Transport Nanosheet Technology for Scaling beyond the Lateral-Transport Devices CMOS EraHemanth JagannathanSusan Fanet al.2023SSDM 2023
Next-Generation Logic Design Architecture for Vertical-Transport NanosheetsBiswanath (Biswa) SenapatiJeongho Doet al.2023SPIE Advanced Lithography + Patterning 2023
Hardware Based Performance Assessment of Vertical-Transport Nanosheet TechnologyGen TsutsuiSeunghyun Songet al.2022IEDM 2022