Characteristics of ultrathin Ta and TaN films
- S.M. Rossnagel
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
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Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
- Hyungjun Kim
- A.J. Kellock
- et al.
- 2002
- Journal of Applied Physics
Time development of microstructure and resistivity for very thin Cu films
- S.M. Rossnagel
- T.S. Kuan
- 2002
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Phase transformation of thin sputter-deposited tungsten films at room temperature
- S.M. Rossnagel
- I.C. Noyan
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
- H. Kim
- C. Cabral
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
- H. Kim
- S.M. Rossnagel
- 2002
- Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
The growth of tantalum thin films by plasma-enhanced atomic layer deposition and diffusion barrier properties
- H. Kim
- C. Cabral Jr.
- et al.
- 2002
- MRS Proceedings 2002
Properties and decomposition behaviors of reactively sputtered Pt(O) electrode materials
- K.L. Saenger
- S.M. Rossnagel
- 1999
- MRS Proceedings 1999
Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
- S.M. Rossnagel
- A. Sherman
- et al.
- 2000
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Fabrication and performance limits of sub-0.1 μm Cu interconnects
- T.S. Kuan
- C.K. Inoki
- et al.
- 2000
- Materials Research Society Symposium-Proceedings