Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Robert Rosenberg
- et al.
- 2013
- Journal of Applied Physics
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61 results for Robert Rosenberg
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- C.-K. Hu
- J. Ohm
- et al.
- 2012
- Journal of Applied Physics
Stress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters
A quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
- Andrew Ying
- Christian Witt
- et al.
- 2011
- Journal of Applied Physics
On the direction of electromigration in gold thin films
- I.A. Blech
- R. Rosenberg
- 2008
- Journal of Applied Physics
Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
Void formation and growth during electromigration in thin films
- R. Rosenberg
- M. Ohring
- 2003
- Journal of Applied Physics
Electromigration damage in aluminum film conductors
- M.J. Attardo
- R. Rosenberg
- 2003
- Journal of Applied Physics