Film properties and integration of a composite PECVD FSG film
- R. Wistrom
- G. Bomberger
- et al.
- 2002
- IITC 2002
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34 results for Jeffrey P. Gambino
High yielding self-aligned contact-process for a 0.150-μm DRAM technology
- Thomas S. Rupp
- David Dobuzinsky
- et al.
- 2002
- IEEE Trans Semicond Manuf
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
Aluminum dual damascene metallization for 0.175 μm DRAM generations and beyond
- R.F. Schnabel
- L. Clevenger
- et al.
- 2000
- Microelectronic Engineering
Cleans for Al vias in a 0.175 μm Dual Damascene Process
- J.P. Gambino
- L. Clevenger
- et al.
- 1999
- IITC 1999
The thermal stability of CoSi2 on polycrystalline silicon: The effect of silicon grain size and metal thickness
- J.P. Gambino
- E.G. Colgan
- et al.
- 1998
- JES
Silicides and ohmic contacts
- J.P. Gambino
- E.G. Colgan
- 1998
- Materials Chemistry and Physics
Dry etch challenges of 0.25 μm dual damascene structures
- R.F. Schnabel
- D. Dobuzinski
- et al.
- 1997
- Vide: Science, Technique et Applications
Effect of contact implants on the patterning of tungsten damascene interconnects
- J.P. Gambino
- M.A. Jaso
- et al.
- 1996
- MRS Spring Meeting 1996