Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2013
- MRS Spring Meeting 2013
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11 results for Connie Truong
Optimizing stressor film deposition sequence in polish rate order for best planarization
- John H. Zhang
- Changyong Xiao
- et al.
- 2011
- MRS Spring Meeting 2011
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement
- Ingrid Shao
- T. Cheng
- et al.
- 2013
- ECS Transactions
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
Cu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- John H. Zhang
- Laertis Economikos
- et al.
- 2010
- MRS Online Proceedings Library
Developing contact oxide CUP process for 32 nm technology nodes
- John H. Zhang
- Rajasekhar Venigalla
- et al.
- 2008
- VMIC 2008
Evaluation of barrier CMP slurries and characterization of ULK material properties shifts due to CMP
- Wei-Tsu Tseng
- Dimitri Kioussis
- et al.
- 2008
- ECS Meeting 2008
Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- Wei-Tsu Tseng
- Sana Rafie
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.