Throughput vs. Yield: reviewing the metrology needs for stochastics-aware process window analysis (SA-PWA)
- Jennifer Church
- Luciana Meli
- 2022
- SPIE Advanced Lithography 2022
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Exploration of pillar local CDU improvement options for AI applications
- Charlie Liu
- Hao Tang
- et al.
- 2020
- SPIE Advanced Lithography 2020
Patterning material challenges for improving euv stochastics
- Anuja De Silva
- Luciana Meli
- et al.
- 2019
- J. Photopolym. Sci. Tech.
Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement
- Katie Lutker-Lee
- Jennifer Church
- et al.
- 2022
- Journal of Vacuum Science and Technology B
In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization
- Xinghua Sun
- Yann Mignot
- et al.
- 2022
- Journal of Vacuum Science and Technology B
Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch
- Jennifer Church
- Luciana Meli
- et al.
- 2020
- J. Micro/Nanolithogr. MEMS MOEMS
Inorganic hardmask development for extreme ultraviolet patterning
- Anuja De Silva
- A. Dutta
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Defect detection strategies and process partitioning for single-expose EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
- Luciana Meli
- Ravi Bonam
- et al.
- 2017
- IEEE Trans Semicond Manuf
Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS