(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineeringB. YangA. Waiteet al.2007IEDM 2007
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithographyS. NarasimhaK. Onishiet al.2006IEDM 2006
Novel enhanced stressor with graded embedded SiGe source/drain for high performance CMOS devicesJ.-P. HanH. Utomoet al.2006IEDM 2006
High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOLW.-H. LeeA. Waiteet al.2005IEDM 2005
Integration and optimization of embedded-SiGe, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologiesM. HorstmannA. Weiet al.2005IEDM 2005
Design of high performance PFETs with strained Si channel and laser annealZ. LuoY.F. Chonget al.2005IEDM 2005
Qualification of 300 mm SOI CMOS substrate material: Readiness for development and manufacturingH.J. HovelM. Almonteet al.2004Solid-State Electronics
A high performance 90 nm SOI technology with 0.992 μm2 6T-SRAM cellMukesh KhareS. Kuet al.2002IEDM 2002