Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
SOI substrates with 300 mm diameter have recently become available for use in circuit development. Little is known at present about the quality of these substrates and how they compare to the well-established 200 mm substrates. This paper outlines several physical and electrical characterization techniques and their use in comparing both bonded and SIMOX 300 and 200 mm SOI material. © 2004 Elsevier Ltd. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
J.C. Marinace
JES