High performance 14nm SOI FinFET CMOS technology with 0.0174μm2 embedded DRAM and 15 levels of Cu metallization
- C.-H.C-H. Lin
- Brian Greene
- et al.
- 2014
- IEDM 2014
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38 results for N. Zamdmer
Off-state self-heating, micro-hot-spots, and stress-induced device considerations in scaled technologies
- Siyu Koswatta
- N. Mavilla
- et al.
- 2015
- IEDM 2015
Chip-level power-performance optimization through thermally-driven across-chip variation (ACV) reduction
- X. Yu
- Oleg Gluschenkov
- et al.
- 2011
- IEDM 2011
Improved effective switching current (Ieff+) and capacitance methodology for CMOS circuit performance prediction and model-to-hardware correlation
- Xiaojun Yu
- Shu-Jen Han
- et al.
- 2008
- IEDM 2008
Highly Manufacturable 40-50 GHz VCOs in a 120nm System-on-Chip SOI Technology
- Jonghae Kim
- Jean-Olivier Plouchart
- et al.
- 2003
- IEDM 2003
Controlling floating-body effects for 0.13μm and 0.10μm SOI CMOS
- S.K.H. Fung
- N. Zamdmer
- et al.
- 2000
- IEDM 2000
ETSOI CMOS for system-on-chip applications featuring 22nm gate length, sub-100nm gate pitch, and 0.08μm2 SRAM cell
- Kangguo Cheng
- A. Khakifirooz
- et al.
- 2011
- VLSI Technology 2011
ETSOI CMOS for system-on-chip applications featuring 22nm gate length, sub-100nm gate pitch, and 0.08μm2 SRAM cell
- Kangguo Cheng
- A. Khakifirooz
- et al.
- 2011
- VLSI Circuits 2011
Reduction of RTA-driven intra-die variation via model-based layout optimization
- J.C. Scott
- O. Gluschenkov
- et al.
- 2009
- VLSI Technology 2009
SOI CMOS technology with 360GHz fT NFET, 260GHz fT PFET, and record circuit performance for millimeter-wave digital and analog system-on-chip applications
- Sungjae Lee
- Jonghae Kim
- et al.
- 2007
- VLSI Technology 2007