Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
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19 results for Roy Yu
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
- K.W. Guarini
- A. Topol
- et al.
- 2002
- IEDM 2002
Reworkable rehealable packaging materials from the introduction of orthogonal dynamic covalent chemistries
- Teddie Magbitang
- Lucas Moore
- et al.
- 2022
- ITherm 2022
3D stacking of high-performance processors
- Philip Emma
- Alper Buyuktosunoglu
- et al.
- 2014
- HPCA 2014
Fine pitch transfer and join (T&J) from MCM to 3DI
- R.R. Yu
- 2009
- ISTC/CSTIC 2009
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
High density 3D integration
- Roy Yu
- 2008
- ICEPT-HDP 2008
FinFET performance advantage at 22nm: An AC perspective
- M. Guillorn
- J. Chang
- et al.
- 2008
- VLSI Technology 2008